Amp'ed RF Technology BT-AP 111 Instrukcja Użytkownika Pobierz pdf (Strona 4)

BT-11 Datasheet

Phone: +1 408 213-9530 | Fax: 408-213-9533 | E-mail: info@ampedrftech.com 4

Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131

电话：+86 022-83945100 | 传真：+86 022-83945100转111 | E-mail: infocn@ampedrftech.com

地址：天津市华苑产业区海泰西路18号西3B-202（300384）

1 Software Architecture

1.1 Lower Layer Stack

 Full Bluetooth v2.1+EDR data rate (3M bps maximum)

 Device power modes—active, sleep and deep sleep

 Wake on Bluetooth feature—optimized power consumption of host CPU

 Authentication and encryption

 Encryption key length from 8-bits to 128-bits maximum

 Persistent FLASH memory—for BD Address and radio parameter storage

 All ACL (Asynchronous Connection Less) packet types (DM1, DH1, DM3, DH3, DM5, DH5, 2-DH1, 2-DH3, 2-

DH5, 3-DH1 3-DH3, 3-DH5, AUX1)

 SCO (Synchronous Connection Oriented) packet types (HV1, HV2, HV3)

 Point to multipoint and scatternet support—3 master and 7 slave links allowed (10 active links simultaneously)

 Park, sniff, and hold modes—fully supported to maximum allowed intervals

 Master slave switch—supported during connection and post connection

 Dedicated Inquiry Access Code—for improved inquiry scan performance

 Dynamic packet selection—channel quality driven data rate to optimize link performance

 Dynamic power control—interference reduction and link performance

 Bluetooth test modes—per Bluetooth specification

 802.11b co-existence—AWMA and AFH

 Vendor specific HCI commands—to support device configuration and certification test modes

1.2 Upper Layer Stack: Amp’ed UP

 SPP, OBEX, SDAP, GAP, and DUN protocols

 RFComm, SDP, and L2CAP supported

 Multipoint with 7 simultaneous slaves

1.3 HCI Interface

 Bluetooth v2.1 specification compliant

 HCI UART transport layer (H4)

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Amp'ed RF Technology BT-AP 111 Instrukcja Użytkownika Strona 4