
BT-11 Datasheet
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6 Hardware Design
Amp’ed RF modules support UART, USB, SPI, I2C and GPIO hardware interfaces. Note that the usage of
these interfaces is dependant upon the firmware that is loaded into the module, and is beyond the scope of
this document.
6.1 Notes
All unused pins should be left floating; do not ground.
All GND pins must be well grounded.
The area around the module should be free of any ground planes, power planes, trace routings, or
metal for 8 mm from the antenna in all directions.
Traces should not be routed underneath the module.
6.2 Module Reflow Installation
The BT-11M/L is a surface mount Bluetooth module supplied on a 24 pin, 6-layer PCB. The final
assembly recommended reflow profiles are:
For non Pb-free applications, Sn63Pb37 solder is recommended.
Maximum peak temperature of 208° - 210°C (below 220°C).
Maximum rise and fall slope after liquidous of < 2°C/second.
Maximum rise and fall slope after liquidous of < 2°C/second.
Maximum time at liquidous of 50 – 90 seconds.
For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended.
Maximum peak temperature of 230° - 240°C (below 250°C).
Maximum rise and fall slope after liquidous of < 2°C/second.
Maximum rise and fall slope after liquidous of < 3°C/second.
Maximum time at liquidous of 40 – 80 seconds.
6.3 GPIO Interface
All GPIOs are capable of sinking and sourcing 8mA of I/O current. GPIO [0] to GPIO [7] are internally
pulled down with 100KΩ (nominal) resistors GPIO [8] to GPIO [15] are internally pulled up with 100KΩ
(nominal) resistors.
6.4 UART Interface
The UART is compatible with the 16550 industry standard. Four signals are provided with the UART
interface. The TXD and RXD pins are used for data while the CTS and RTS pins are used for flow control.
Connection to Host Device
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